學系成員

邱奕翔 Yi-Hsiang Chiu 明新科技大學電子系 兼任助理教授

  • 學歷

    北京大學 集成電路學院微電子學與固體電子學 博士

    清華大學 電機資訊學院積體電路設計 碩士

    中華大學 電機工程系

    大同商專 資訊管理科

    經歷

    茂丞超聲科技 總經理暨創辦人

    聚積科技 技術市場/策略行銷經理

    微智半導體 總經理暨創辦人

    研究專長

    機器人伺服馬達技術、第三代半導體氮化鋁壓電材料、傳感器晶片與界面電路設計、三維微系統封裝技術、科技創業與營運、科技創新與前膽

  • 期刊論文

    1. Chen, Wenxing, Shenglin Ma, Xiaoyi Lai, Zhizhen Wang, Hui Zhao, Qiang Zha, Yihsiang Chiu, and Yufeng Jin. 2024. "Design, Fabrication, Characterization, and Simulation of AlN-Based Piezoelectric Micromachined Ultrasonic Transducer for Sonar Imaging Applications" Micromachines 15, no. 6: 781.
    2. Chiu, Yihsiang, Li Wang, Dan Gong, Yang Yang, Weili Wang, Nan Li, Shenglin Ma, and Yufeng Jin. 2021. “An alN-Based Piezoelectric Micromachined Ultrasonic Transducer with a Double-Beam Suspended Structure.” Journal of the Chinese Institute of Engineers 45 (2): 150–60.
    3. Chiu, Yihsiang, Chen Wang, Dan Gong, Nan Li, Shenglin Ma, and Yufeng Jin. 2021. "A Novel Ultrasonic TOF Ranging System Using AlN Based PMUTs" Micromachines 12, no. 3: 284.
    4. S. -S. Tan, C. -Y. Liu, L. -K. Yeh, Y. -H. Chiu, M. S. . -C. Lu and K. Y. J. Hsu, "An Integrated Low-Noise Sensing Circuit With Efficient Bias Stabilization for CMOS MEMS Capacitive Accelerometers," in IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 58, no. 11, pp. 2661-2672, Nov. 2011, doi: 10.1109/TCSI.2011.2142990.

  • 會議論文

    1. D. Gong, S. Ma, Y. Chiu, H. Lee and Y. Jin, "Study of the Properties of AlN PMUT used as a Wireless Power Receiver," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019, pp. 1503-1508.
    2. D. Gong, Y. Chiu, S. Ma, Y. Jin and H. Li, "Study on AlN micromachined ultrasonic transducer array with beamforming," 2019 20th International Conference on Electronic Packaging Technology(ICEPT), Hong Kong, China, 2019, pp. 1-5.
    3. L. Wang, Y. Chiu et al., "Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure," 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Bangkok, Thailand, 2019, pp. 514-519.
    4. W. Wang, Y. Chiu et al., "Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array," 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Bangkok, Thailand, 2019, pp. 482-487.
    5. W. Wang, Y. Chiu et al., "Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array," 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Bangkok, Thailand, 2019, pp. 482-487.
    6. N. Li, Y. Chiu et al., "Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics," 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Bangkok, Thailand, 2019, pp. 540-544.
    7. D. Gong, Y. Chiu et al., "Fabrication and characterization of AlN based Piezoelectric Micromachined Ultrasonic Transducer for contact sensing," 2018 19th International Conference on Electronic Packaging Technology (ICEPT), Shanghai, China, 2018, pp. 1442-1447.
    8. S. S. Tan, C. Y. Liu, L. K. Yeh, Y. H. Chiu and K. Y. J. Hsu, "A new process for thermally stable CMOS MEMS capacitive sensors," 2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Kaohsiung, Taiwan, 2011, pp. 329-332.
    9.  S. S. Tan, C. Y. Liu, L. K. Yeh, Y. H. Chiu, M. S. . -C. Lu and K. Y. J. Hsu, "Design of low-noise CMOS MEMS accelerometer with techniques for thermal stability and stable DC biasing," IEEE Custom Integrated Circuits Conference 2010, San Jose, CA, USA, 2010, pp. 1-4.

  • 相關著作與專利

    技術報告

    1. 台灣CMOS MEMS技術發展與現況 零組件雜誌 2008, Dec. vol.206, pp. 116-121


    專利

    1. 晶圓級超聲波晶片規模製造及封裝方法 I661493
    2. 晶圓級超聲波晶片模組及其製造方法 I675498
    3. 具懸浮結構的晶圓級超聲波晶片模組及其製造方法 I702741
    4. 晶圓級超聲波感測裝置及其製造方法 I712190
    5. 微機電系統元件與特殊應用處理電路晶片之積體封裝方法和結構 I700756
    6. 晶圓級超聲波裝置及其製造方法 I729605
    7. 晶圓級超聲波晶片裝置 M595789
    8. 陣列式超聲波感測器 I763270
    9. 陣列式超聲波感測器 M614257
    10. 懸浮式壓電超音波感測器及其製作方法 I809455
    11. 懸浮式壓電超音波感測器 M618737
    12. 晶圓級超聲波元件檢測裝置 M619610
    13. 壓電微機械超聲波換能器及其壓電微機械超聲波換能器陣列 I82945
    14. 壓電微機械超聲波換能器的封裝結構 M644027
    15. 晶圓級超聲波晶片組件及其製造方法 I692888
    16. 具有支撐效果的杯套與形成杯套的平板 M607526
    17. 具有支架功能的杯套與形成杯套的平板 M604307
    18. 附支撐功能的杯套 M602538
    19. Ultrasonic module and method for manufacturing the same. 2020-US10657349-B2
    20. Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof. 2022-US-11478822-B2
    21. Wafer scale ultrasonic sensor assembly and method for manufacturing the same. 2022-US-11460341-B2
    22. Wafer scale ultrasonic sensing device and manufacturing method thereof. 2021-US-11075072-B2
    23. Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same. 2021-US-11130674-B2
    24. Wafer level ultrasonic device and manufacturing method thereof. 2023-US-11806751-B2
    25. Array-type ultrasonic sensor. 2023-US-11548031-B2

  • 得獎事蹟

    2021年長三角兩岸青年創新創業大賽一等獎

    2019年度北京大學台灣學生博士特等獎學金

    2018年大同技術學院傑出校友獎

    2012年聚積科技MVP獎

    2009年創業企業獲經濟部小型企業創新研發計畫（SBIR）

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